AIM’s NC257MD solder paste has been specifically developed for Mycronic Jet Printers. Its unique rheological properties were engineered and validated through extensive testing in collaboration with Mycronic to provide continuous and consistent deposits. NC257MD prolongs ejector life and reduces paste scrap and consumption.
The superior wetting ability of NC257MD results in bright, smooth and shiny solder joints and reduced voiding on BGA and BTC devices. NC257MD produces low post reflow flux residues, which remain crystal clear and easily probed even at elevated temperatures.
Supplied as standard in lead-free alloy SAC305. For leaded alloys please click here.
Key Product Features & Benefits:
– Capable of 200µm deposits
– Low Voiding: <5% on BGA and <10% on BTC Components
– Eliminates HiP Defects
– REACH and RoHS Compliant (Lead-Free)
– Powerful Wetting on Lead-Free Surface Finishes
– Passes Bono Testing
– Available in SAC305 Alloys
– ROL0 per IPC J-STD-004 and ROL1 per J-STD-004B (3.3.1)
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