When printing using Solder Paste, Stencil apertures can quickly clog if that material is left to dry out, causing misprints and solder defects. Today, optimising print processes is becoming increasingly more critical as technology seeks greater miniaturisation requiring aperture sizes and stencil thickness to further reduce.

Solder Connection produce a range of cleaning chemicals designed specifically for stencil and ensure that apertures are kept clear when printing. Available in a variety of solutions from manual sprays and wipes to bulk chemicals for automatic cleaning. Our Sales Team is available to offer cleaning advice for your cleaning process and recommend a product that best suits your application.