Solder Connection offers an comprehensive range of tape and reel preforms, bespoke preform designs, ribbon, foil and spheres for BGA rework.
Senju Tape & Reel
Senju Tape and Reel Preforms offer consistent and reliable solder volumes. Tape & Reel packaging allows preforms to be implemented into automated SMT processes. Available from 1406 to 0201 component sizes.
Senju’s Tape and Reel preforms may be available in other sizes and alloys. To discuss your application or request a quotation contact our Sales team. MOQ’s may apply for not standard products.
|Chip Size||Alloy||Reel Size||Size (mm)||Temp (°C)|
|Lead-Free||0402||SAC305||5000||1.0 x 0.5 x 0.5||217 - 220|
|Lead-Free||0603||SAC305||4000||1.6 x 0.8 x 0.8||217 - 220|
|Leaded||0402||SAC305||5000||1.0 x 0.5 x 0.5||183|
|Leaded||0603||SAC305||4000||1.6 x 0.8 x 0.8||183|
Puralloy® Solder Preforms offer the ability to provide a precise volume of solder for each solder joint that is uniform over high volumes. Preforms effectively provide high volume solder assembly operations with increased yield, via precise delivery & control of solder to each interconnect. Preforms are engineered solutions offering the technician consistent solder volume for joint reliability and giving reduced flux residues which improves electrical reliability, and reduces voids.
Puralloy® preforms can include fluxed and un-fluxed rectangles, washers, sleeves, and custom shapes for specific applications, available in common leaded and lead free alloys. To discuss your application contact our Technical Sales Team.