Senju Solder Paste

Senju is at the forefront of development for new solder pastes offering both printable and jetting solder pastes in a range of flux types and solder alloys.

Senju Solder Paste

Senju is at the forefront of development for new solder pastes to address society’s ever changing need for faster communication, greater memory , product miniaturisation, higher reliability in automotive and medical fields, together with personnel devices and wearables.

Senju now offers both printable and jetting solder pastes that utilise particle 6 powder which can easily cope with 01005 chips and micro BGA devices. Common process problems such as Voiding, BGA Head in Pillow (HIP ), flux and solder splatter during laser reflow, low temperature alloys for temperature sensitive components and the need for stronger alloys offering higher reliability under shear strain and drop shock have all been addressed and are commercially available

Lead-Free Paste

Performance IndicatorsProductSAC305M794M10M40L29Type 4Type 5Type 6J-STD
Low VoidingGRN360-K1-V8xxxROL0
Fine Pitch PrintingULT369xxROL0
Ultra-FineRGS800HF xxxROL0
Low TemperatureL29-145HFxxROL0

Leaded Paste

Performance IndicatorsProduct63/3762/36/2Type 3J-STD
Excellent Reliability221CM-ZxxxROL0
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