AIM Solder Paste
AIM Solders complete line of solder paste has been developed to deliver robust performance, ease of use and cost effectiveness across a range of alloys and flux formulations.
AIM Solder Paste
AIM’s complete line of solder paste has been developed to deliver robust performance, ease of use and cost effectiveness. AIM solder pastes resolve difficult issues including QFN voiding, low area ratio printing, and high reliability requirements for consumer, LED, automotive, aerospace and military applications.
AIM solder paste is available in no clean, water soluble, and RMA formulations, with a wide variety of alloy offerings including AIM’s proven REL alloys, SAC, SN100C® and lead-based solders. Available throughout Ireland and Northern Ireland.
Lead Free Paste
Product | Flux Type | Standard Alloy | Powder Size | J-STD | Key Attributes |
---|---|---|---|---|---|
M8 | No Clean | REL22™ REL61™ SAC305 | T4 -T6 | ROL0 / ROL1 | - Fine Pitch Printing - Low Voiding - Mitigates Print Defects |
H10 | No Clean | REL22™ REL61™ SAC305 | T4 | ROL0 | - Halogen & Halide Free - Low BTC & BGA Voiding - High Reliability |
V9 | No Clean | SAC305 | T4 | ROL0 / ROL1 | - Low Voiding |
NC257MD | No Clean | SAC305 | T5 | ROL0 / ROL1 | - For use in Mycronic Jet Printers |
J8 | No Clean | SAC305 | T6 | ROL0 / ROL1 | - Capable of 200μm deposits |
W20 | Water Soluble | SAC305 | T4 | ORM0 | - Halogen & Halide Free |
NC273LT | No Clean | Sn/Bi/Ag | T4 -T6 | ROL1 | - Low or Reduced temperature Applications |
RMA258-15R | Rosin | SAC305 | T4 | ROL0 | - Long Pause-to-Print Capabilities |
Leaded Paste
Product | Flux Type | Standard Alloy | Powder Size | J-STD | Key Attributes |
---|---|---|---|---|---|
M8 | No Clean | 63/37 | T4 -T6 | ROL0 / ROL1 | - Fine Pitch Printing - Low Voiding - Mitigates Print Defects |
NC257MD | No Clean | 63/37 | T5 | ROL0 / ROL1 | - For use in Mycronic Jet Printers |
J8 | No Clean | 63/37 | T6 | ROL0 / ROL1 | - Capable of 200μm deposits |
RMA258-15R | Rosin | 63/37 62/36/2 | T4 | ROL0 | - Long Pause-to-Print Capabilities |