When printing solder paste or SMD adhesive stencil apertures can very quickly partially block if material is left to dry out during changeovers, effecting overall yield due to misprints and solder defects. Today the print process is critical because our technology continually seeks greater miniaturisation, requiring aperture sizes to further decrease.
TSC Stencil Wipes are well proven to remove both solder paste and uncured adhesives with equally high efficiency. Stencil wipes consist of a high wet strength fabric, pre-saturated with a solvent. The wipes are easily dispensed from a re-sealable tub which retains the powerful solvent saturation.
They also provide you with an excellent option when manually cleaning equipment, contact surfaces, precision bearing slides, machine contacts, optical sensors, and tooling supports.
Solder Connection Stencil Wipes are supplied in Tubs of 200 sheets.
Key Product Features and Benefits
– Supplied as 200mm x 200mm sheets
– Easily dispensed.
– Resealable tub prevents drying out.
– Polyester /Cellulose construction.
– Low Linting
– Excellent absorbency