Delta DSP 863 utilises a unique flux system designed specifically for high temperature lead free alloys. It provides the fluxing activity levels that promote thermal stability and prevents thermal degradation when reflowing under air atmosphere (normal). Since use of nitrogen is not required, DSP 863 Lead Free solder paste will provide excellent cost savings.
In addition, DSP 863 Lead Free solder paste exhibits superior joint strength, excellent wettability, and extraordinary print definition and tack life. The post soldering residues of DSP 863 are non-conductive, non-corrosive and highly insulated.
Key Product Features and Benefits:
– Low Voiding
– Excellent wettability
– Long tack time
– Excellent hot slump resistance
– Medium soft non-cracking residues
– Extended stencil life
– Available in lead-free alloys SAC305 & Sn42 Bi57 Ag1
– No Clean Formulation – Residues do not need to be removed.