AIM’s J8 No Clean Jetting Solder Paste is specially formulated for use with jetting equipment providing consistent solder deposits as small as 200µm. J8 is fully compatible with all AIM no clean solder pastes for use in applications where combining jetted paste deposits with printed paste deposits is required.
J8 has a novel activator system providing powerful, durable wetting action accommodating a wide range of profiling producing bright shiny joints without graping defects. J8 has reduced voiding to as low as <5% on BGA and <10% on BTC ground pads.
Supplied as standard in leaded alloys Sn63/Pb37. For lead-free alloys please click here.
Key Product Features & Benefits:
– Capable of 200µm deposits
– Low Voiding: <5% on BGA and <10% on BTC Components
– Eliminates HiP Defects
– REACH and RoHS Compliant (Lead-Free)
– Powerful Wetting on Lead-Free Surface Finishes
– Passes Bono Testing
– Available in Sn63/Pb37 Alloys
– ROL0 per IPC J-STD-004 and ROL1 per J-STD-004B (3.3.1)
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