AIM’s M8 H10 Halogen-Free No Clean Solder Paste is engineered to provide robust, stable performance for automotive, LED lighting and aerospace assemblies. H10 solder paste is capable of transfer efficiency >90% on area ratios of 0.50 and a stencil life >8 hours. H10’s powerful wetting characteristics eliminate NWO (HiP) defects and improve pad coverage on all surface finishes.

H10 reduces voiding on BGA, BTC and LGA and offers enhanced electrochemical reliability on all low stand-off devices. H10 is zero halogen per EN14562 and halide-free per IPC J-Std-004 current rev. H10 is compatible with AIM’s full line of no clean flux chemistries.

Supplied as standard in lead-free alloy SAC305 as well as AIM’s specialist High Reliability alloys REL61™ and REL22™. These have been developed to meet the demands of an evolving solder market. Greater durability, lower costs and lower processing temperature are key drivers and AIM REL61 and REL22 provide assemblers with new tools to improve product quality in the assembly process. REL alloys have demonstrated reduced tin whisker formation as well as outperforming SAC alloys in thermal shock, vibration and drop shock resistance, making these alloys the ideal choice for all electronics applications.

Key Product Features & Benefits:

– Halide/Halogen-Free
– Excellent Wetting
– Low BTC and BGA Voiding
– High Reliability
– Print Capability to 0.50 Area Ratio with T4
– Available in Multiple Lead-Free Alloy
– REACH and RoHS Compliant*
– ROL0 per IPC J-STD-004B

AIM’s Product Range available from the Solder Connection throughout Ireland and Northern Ireland only.

Weight 0.55 kg


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