QUALITEK LOW MELT POINT (SN42/BI58) SOLID WIRE

The 0.8mm LMP Wire is currently out of stock. An alternative may be available, please contact our Sales Office to discuss.

Qualitek Low Melt Point Solid Solder Wire is designed as a lead-free alternative for Sn/Pb alloys for electronics assembly operations. With a solder alloy of Sn48 / Bi58 and a melting point of 138°C, LMP Solder Wire is ideal for soldering of temperature-sensitive components.

The Tin/Bismuth alloy conforms and exceeds the impurity requirements of J-STD-006 and all other relevant international standards. This is a solid wire, so a suitable flux is required. For electronic applications look to use Qualitek 381 flux or PF670 flux gel to promote increased rapid wetting. This wire is packaged as a 500g box.

Key Product Features & Benefits:

– Supplied in Tin/Bismuth (42 / 58) Alloy.
– Supplied as a boxed quantity of 500g (Boxed not reeled)
– Low melting point, prevents thermal degradation of heat sensitive components.
– Acceptable wetting & flowing characteristics
– Prevents thermal damage to heat-sensitive devices
– Not recommended for handheld devices due to Tin Bismuth brittle element (Products that can be subject to drop-shock)
– Designed for Printed Circuit Board assembly (temperature-sensitive component soldering)
– Low to non-toxic lead-free solder