The HP200D Solder Dipping Pot is a circular, bench-top pot, ideal for the reliable control of solder temperature in a range of manufacturing environments. Typical uses of the HP200D include tinning the ends of wire leads, pre-tinning electrical parts, re-tinning soldering iron tips and dip soldering printed circuit boards.
The HP200D has a temperature range that is suitable for both Leaded and Lead-Free solders, reaching a maximum temperature of 450°C. The internal pot dimensions of the HP200D are 63 x 51mm (Diameter x Depth). The pot incorporates a digital temperature control, accurate to +/- 5°C.
Key Features & Benefits:
– Capacity: 1.4 Kg/Pb
– 130W Power Consumption
– Temperature Range: 450°C
– Internal Pot Dimensions: 63 x 51mm (Diameter x Depth)
– Digital temperature control to +/- 5°C
– Suitable for Leaded and Lead-Free solders