MG Chemicals offers conductive paints for package and board level shielding applications. At the package level, these coatings are applied directly onto board components such as ICs preventing EMI from interfering with other board components. This approach saves both cost and space by replacing larger metal stamps and lids. It can also be used in component fabrication replacing the sputter coating process of silicone wafers.

At the board level, these coatings are used to coat entire circuits where individually shielding components becomes too difficult. Here, an insulating coating is first deposited onto the PCB to electrically isolate components and a conductive topcoat is then applied. These coatings can also be used on traditional applications such as PCB housing interiors.