Solder Connection

Solutions in Soldering Technology


RMA9086 (Opti-Line 9086) Solder Paste

ALPHA® RMA-9086 (Opti-Line 9086) solder paste is designed for use in the assembly of high reliability circuit boards. It is designed to be user friendly with easy printing characteristics with a wide reflow profile window. Long stencil life and tack time are inherent features to cope with line stoppages and idle periods. 

RMA-9086 will give excellent soldering results in air reflow systems, without the need for an oxygen reducing atmosphere on any common surface finish.  The residues left around the reflowed solder joint are visibly clear, non-hygroscopic and non-corrosive and can therefore be left on the board without the need for cleaning.

Key Products Features & Benefits: 

  • Can be successfully reflowed in any conventional infra-red or convective heat ovens. 
  • The unique flux vehicle will promote wetting to all common surface finishes  used for printed circuit boards and components alike. 
  • J-STD Classification: ROL1

 

Product Number : RMA9086

Prod. No. 10380
Alpha RMA9086 62/36/2 500g

Prod. No. 10394
Alpha RMA9086 63/37 500g

Data Sheets and Info

Health & Safety

Technical Bulletin

ROHS Certificate

FAQ's

Q - Do we need to return to fridge after use?
A - If you are going to continue the next day, then no you should not return the paste to the fridge.

Q - How long do l have to leave the paste before l can use it once taken from the fridge?
A - Always allow the paste to come up to ambient temperature, take it out of the fridge the night before seems to work well.

Q - I need to achieve better print definition, should l look at a finer solder particle size?
A - Your first call should be to your stencil manufacturer, and see if the aperture design is correctly optimised for you design and process capabilities?

Q - Is a framed stencil a more stable print platform than a stretched foil ?
A - Not today, most foil tensioning systems will give similar print stability as would framed stencils. Much is down to cost or personnel choice.

Q - Once printed how soon before l need to place my components?
A - Always place components before the end of your shift, this has to be good practice.

Q - What kind of print speeds can l use.
A - Always refer to the Technical Data sheet for the specific product, but, to initiate and create excellent shear thinning of the solder paste and promote paste roll a suggestion would be to start at 40mm/s and adjust according to process requirements, changes to pressure / release speed / release height could also be considered to achieve maximum performance.

Q - How long can l leave the paste container out at room temperature? You can safely leave the paste out on the bench for the duration of your shift.
A - You can safely leave the paste out on the bench for the duration of your shift.

Q - What is colophony and can it cause any health issues?
A - Colophony is a generic term for rosin, this is the sap or sticky substance that derives from pine and spruce trees. Its "stickiness" lends itself to being used in a wide range of products. We have traditionally used this product in fluxes due to these specific properties it can however lead to breathing difficulties and skin sensitivity. Always use fume filtration when soldering and change filters regularly.

Q - What is the difference between rosins and resins?
A - The terms are often used interchangeably, but rosin is a naturally occurring substance, and resin is either a modified rosin or completely synthetic material. Rosins are plant based products and are subject to more natural variation than resins, however resins are commonly used in newer flux formulations due to their more consistent performance.

Q - Do I need to change my printing process when I go to finer printing from size 3 to size 4 paste?
A - Generally when changing from T3 to T4 there is not much difference in printing setup. Depending upon the paste used you may have to make slight adjustments to print parameters such as release speed as aperture fill is greater with finer powders on small apertures but this is just to optimise the print as you would do when changing any paste. It’s by no means certain you will need to do this but it may give you further benefits.

Q - Do I need to change my printing process when I go to Ultra Fine printing from size 4 to size 5 paste?
A - The biggest change will be going to PS5 and its not so much the printing parameters changing but the stencils are invariably a lot thinner and so you need good support and setup such as making sure you have a release distance of 3 mm set (the distance over which release speed is controlled as the stencil acts more like a drum skin) I would also run with the minimum pressure to avoid stencil damage (coining) this is as most PS stencils are <100µm typically 75µm in thickness. It’s not as bad with PS4 as most stencils are in the 100µm or slightly above range and are more robust.

In all cases (can’t really think of an exception) smaller powder sizes go hand in hand with printing smaller features. Smaller features as we approach Area Ratio 0.66 and in some cases people try to/do operate in the region of AR 0.6-0.66 mean that the printing process has to be good, you have to “respect the fundamentals” i.e. board support, calibration of such things as print height, squeegee condition, decent PCB quality, registration etc.

Again more a feature of small apertures rather than the powder size of paste itself you may need to look at what is your maximum ‘abandon’ time with any paste if you run a start stop process and work to it i.e. don’t exceed and use automatic under screen cleaning where needed. Smaller apertures tend to ‘clog’ more readily and so may need a more frequent aperture clean regime.

Associated Products

Fluitin 1535 60/40 Leaded Solder Wire

More Info

Waste Paste Buckets

More Info

Screen and Stencil Wipes SSW

More Info

OM-338T Lead-Free Solder Paste

More Info