Solder Connection

Solutions in Soldering Technology

Non Silicone Heat Transfer Compound Plus HTCP

HTCP provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil. The exceptional properties obtained from HTCP are due to the novel use of various metal oxide (ceramic) powders. These materials are electrically insulative to ensure that leakage currents can not be formed if the paste should come into contact with other parts of the assembly.

Key Product Features & Benefits:

  • Excellent non-creep characteristics
  • Very high thermal conductivity; 2.50 W/m.K
  • Wide operating temperature range: -50°C to +130°C
  • Low evaporation weight loss
  • White colour enabled treated parts to be easily identified
  • Low in toxicity


Prod. No. HTCP20S
Heat Transfer Compound Plus 20ml

Prod. No. HTCP700G
Heat Transfer Compound Plus 700g

Prod. No. HTCP01K
Heat Transfer Compound Plus 1KG

Prod. No. HTCP25K
Heat Transfer Compound Plus 25KG

Data Sheets and Info

Health & Safety

Technical Bulletin

Product Guide

Related Technical Documents

Associated Products

Silicone Heat Transfer Compound HTS

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Non Silicone Heat Transfer Compound HTC

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Silicone Heat Transfer Compound Plus HTSP

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