Radsol T208C is a mild extremely efficient alcohol based flux is ideal for dipping applications designed for copper and copper alloys.
Radsol T208 Fluxes find uses wherever a mild, though efficient, fluxing is required. They are particularly suitable as a substitute for the traditional resin safety fluxes where the stickiness of the resin cannot be tolerated. They are most efficient on plain copper and brass. They can also be used on tinned surfaces, solder plating, nickel plating, tin/nickel plating, silver plating and gold plating.
Key Products Features & Benefits:
Alcohol based – Very low latent heat of fusion reduces solder spitting when dipping. If residue removal is required, the residues are extremely water-soluble or, if preferred, can be removed with most polar type solvents.
Prod. No. 52664 - 10L
FRYS RADSOL T208C FLUX - 10L
Health & Safety