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Solutions in Soldering Technology

Radsol T208B Flux

Radsol T208B is a mild water based flux ideal for dipping applications designed for copper and copper alloy products.

Radsol T208 Fluxes find uses wherever a mild, though efficient, fluxing is required. They are particularly suitable as a substitute for the traditional resin safety fluxes where the stickiness of the resin cannot be tolerated. They are most efficient on plain copper and brass. They can also be used on tinned surfaces, solder plating, nickel plating, tin/nickel plating, silver plating and gold plating.

Key Products Features & Benefits: 

  • Zinc chloride free - ensuring inert, non-corrosive post soldering residues
  • Mild – Soldering heat decomposed the small proportion of active material normally removing the need for washing.
  • Water based – Ideal for small, clean Copper or Copper alloy components


Prod. No. 56635 - 10L


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