Solder Connection

Solutions in Soldering Technology

EF-6000 - Wave & Selective Soldering Flux

ALPHA® EF-6000 was specifically developed to deliver outstanding board cosmetics and to eliminate the tendency for solder balling and solder bridging, two types of defects which are normally associated with the use of the chip wave. Of all low solids (< 4% solids), no-clean fluxes, ALPHA EF-6000 exhibits the lowest tendency for solder ball generation over a wide variety of solder masks during wave soldering and Selective Soldering operations. ALPHA EF-6000 should be considered for use by any assembler who has board designs which are sensitive to solder bridging, performs pin testing, or whose specification requires an extremely low frequency of solder balls.

EF-6000 is an active, low solids, no-clean flux. It has been designed with a wide thermal process window enabling best-in-class productivity with lead-free wave soldering applications, and is an excellent choice for remaining tin-lead production lines. It is formulated with a proprietary mixture of organic activators.

Key Product Features & Benefits: 

  • Thermally stable activators provide the lowest solder bridging in a low-solids, no-clean flux for wave soldering and Selective Soldering in tin-lead and lead-free applications.
  • Reduces the surface tension between solder mask and solder to provide the lowest solder ball frequency of any low solids, no-clean flux.
  • Very low level of non-tacky residue to reduce interference with pin testing and exhibit no visible residue.
  • Cleaning is not required which reduces operating costs.
  • IPC-J-STD-004 compliant for long term electrical reliability.

Selective Soldering - A Brief Guide

Classified J Standard ORL0 

Shelf Life - 12 Months from DOM


Product Number : EF-6000

Prod. No. 145413.0010

Prod. No. 145413.0005

Prod. No. 145413.0001

Data Sheets and Info

Health & Safety

Technical Bulletin

Product Flyer

Product Guide

ROHS Certificate


Q - What does Halide free mean?
A - In many fluxes halides are added to the activation package to promote solderability. In the case of this flux solderability and wetting has been achieved using a range of chemistries which do not contain halides. The inclusion of halides within a flux can promote post soldering residues to become active in the presence of moisture and temperature fluctuations and promote corrosion long term which in turn can cause pcb failure.

Q - What is colophony and can it cause any health issues?
A - Colophony is a generic term for rosin, this is the sap or sticky substance that derives from pine and spruce trees. Its "stickiness" lends itself to being used in a wide range of products. We have traditionally used this product in fluxes due to these specific properties it can however lead to breathing difficulties and skin sensitivity. Always use fume filtration when soldering and change filters regularly.

Q - What is the difference between rosins and resins?
A - The terms are often used interchangeably, but rosin is a naturally occurring substance, and resin is either a modified rosin or completely synthetic material. Rosins are plant based products and are subject to more natural variation than resins, however resins are commonly used in newer flux formulations due to their more consistent performance.

Q - How does IPCJ-STD-004B flux classification work.
A - Flux designation has three components. The first two letters, RO, RE or OR, represent the basic chemical composition: rosin-based, resin-based or organic acid-based. The next component is flux designation, L, M or H, which describes the flux’s activity level as low, medium or high, and the final component, 0 or 1, this indicates if halides are present.

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