Solder Connection

Solutions in Soldering Technology

TSC CleanPro 40 Oven & Process Equipment Cleaner

TSC CleanPro 40 is a high performance cleaner for fast, easy removal of burnt on flux residues from equipment such as Reflow Ovens, Wave and Selective type soldering systems together with PCB process carriers. TSC CleanPro 40 can be sprayed onto the areas to be cleaned, preferably when warm up to 50 deg. C. Residues are then allowed to soften and dissolve.

Any very heavy residues should be agitated with a suitable brush whilst applying the cleaner with repeated applications if required for very heavy burnt on flux deposits. The dissolved residues are then either rinsed or wiped away with water. Any waste can be incinerated. Ensure over spray is kept to a minimum to avoid prolonged contact with any painted finishes.

Supplied as standard in 1L Spray Bottles. Other sizes available on request.

Key Features & Benefits:

  • Powerful aprotic solvent based formulation free of CFC, HCFC, HFE, Phosphates, Surfactant and any harmful or ozone depleting ingredients.
  • Safe to use, non volatile, non flammable, low odour and low toxicity for maximum safety in use.
  • Versatile application - removes burnt on hardened flux residues from all types of metals and plastics including tooling, fixtures and wave solder pallets.
  • Reduced environmental impact - lower VOC content and low vapour pressure, ozone friendly.
  • Bio-degrades and rinses or wipes away completely with water


Product Number : CL-041-083

Prod. No. CL-041-083
TSC CleanPro 40 1L Trigger Spray

Data Sheets and Info

Health & Safety

Technical Bulletin