KYZEN CYBERSOLV C8508 is an aqueous based cleaner for reflow ovens and general equipment maintenance. C8508 effectively removes adherent residues outgassed during the reflow-soldering step of surface mount assemblies that includes solder paste activators and functional additive build-up. C8508 is extremely effective at removing the toughest baked-on flux residues including the latest lead-free formulations.
C8508 is compatible with all materials commonly used in electronic assembly manufacturing and cleaning processes, including tools and accessories made of aluminium, copper and brass materials. C8508 is an excellent preventative maintenance product and is ideal for cleaning all soldering equipment types on the assembly floor.
Key Product Features and Benefits:
|Typical Process||Product Properties|
|Process: Manual, Spray or Immersion||PH (10G/L): 10.7|
|Concentration: 100%||Flash Point: None to Boiling|
|Temperature: Room Temperature||Boiling Point: 221°F / 105°C|
|Rinse: Clean Wet Cloth||Water Solubility: Complete|
|Dry: Air||VOC @ 100%: 299|