KYZEN E5325 is used in spray-in-air applications to effectively and efficiently perform off-line maintenance cleaning to remove even the most difficult fluxes and solder pastes from pallets, wave solder fingers, reflow oven parts and associated tooling. E5325 has proven compatible with aluminium, copper, and steel as well as standard materials used in reflow oven systems, wave solder, and associated tooling.
E5325 is a low odour solution that delivers successful results with minimal exposure time. E5325 will reduce maintenance and machine downtime therefore increasing production and reducing overall cost. E5325 has no VOCs making it a great choice as an environmentally friendly chemistry.
Key Product Features and Benefits:
|Typical Process||Product Properties|
|Process: Spray||PH (10G/L): 11|
|Concentration: Pallets: 3-10%|
|Flash Point: None to Boiling|
|Temperature: Ambient to 140°F/60°C||Boiling Point: 217°F / 103°C|
|Rinse: Optional / DI Water||Water Solubility: Complete|
|Dry: Hot Air||VOC @ 10%: 0.0 g/L|