Solder Connection

Solutions in Soldering Technology

KYZEN E5325 Maintenance & Pallet Cleaner

KYZEN E5325 is used in spray-in-air applications to effectively and efficiently perform off-line maintenance cleaning to remove even the most difficult fluxes and solder pastes from pallets, wave solder fingers, reflow oven parts and associated tooling. E5325 has proven compatible with aluminium, copper, and steel as well as standard materials used in reflow oven systems, wave solder, and associated tooling.

E5325 is a low odour solution that delivers successful results with minimal exposure time. E5325 will reduce maintenance and machine downtime therefore increasing production and reducing overall cost. E5325 has no VOCs making it a great choice as an environmentally friendly chemistry.

Key Product Features and Benefits:

  • Successful Results with Minimal Wash Time
  • Low Odor
  • Compatible with Aluminium, Copper, Steel, and Epoxy or Polyester Composites
  • Can Be Used on Wave Solder, Reflow Oven Systems, and Associated Tooling
  • E5325 is RoHs compliant and Halogen-free

Product Data
Typical Process
Product Properties
Process: Spray
PH (10G/L): 11
Concentration: Pallets: 3-10%
                                    Maintenance: 5-10%
Flash Point: None to Boiling
Temperature: Ambient to 140°F/60°C
Boiling Point: 217°F / 103°C
Rinse: Optional / DI Water
Water Solubility: Complete
Dry: Hot Air
VOC @ 10%: 0.0 g/L


Product Number : E5325

Data Sheets and Info

Health & Safety

Technical Bulletin

Related Technical Documents