Solder Connection

Solutions in Soldering Technology

Cybersolv C8622 IPA Alternative Solvent

KYZEN CYBERSOLV C8622 is a full-strength solvent blend specifically designed as an IPA alternative for under stencil wiping and manual bench top cleaning applications. C8622 is ideally suited for dissolving un-reflowed solder paste during the stencil printing process, and can be applied as received in any application where IPA is typically used.

CYBERSOLV C8622 improves stencil printing yields by removing trace solder paste deposits from the stencil aperture. C8622 is safe and effective in all IPA applications, boasting extensive compatibility and low odour. CYBERSOLV C8622 dries spot free and does not require a rinsing step, however, if needed, use fresh C8622 or Hot DI Water.

Key Product Features and Benefits:

  • For Spray-in-Air and Select Ultrasonic Cleaning Machines
  • Removes Un-Reflowed Solder Paste and Flux
  • Effective on Uncured Adhesives
  • No Rinse Required
  • Excellent Compatibility
  • Non-hazardous, biodegradable aqueous solution

Product Data
Typical Process
Product Properties
Process: Manual & Stencil Wipe
PH (10G/L): 5.7
Concentration: 100%
Flash Point: 147°F / 64°C
Temperature: Ambient
Boiling Point: 217°F / 103°C
Rinse: None Required
Water Solubility: Complete
Dry: Air
VOC @ 100%: 296 G/L


Product Number : C8622

Data Sheets and Info