Senju Sparkle 221CM-Z Series Leaded Solder Paste is an excellent general purpose solder paste is most commonly available as 62SN/36PB/2AG alloy with a melt point of 178 degrees C.
Utilising particle size 4 solder particles gives this paste excellent print characteristics across a wide range of apertures, good workability during the printing cycle, long stencil life and superb solderability across a number of different solderable finishes including OSP. Long term reliability has proven to be a good positive point in choosing this solder paste ahead of the competition.
221CM-Z offers superior cosmetics after oven reflow with very little flux discolouration or cracking evident under inspection. It is ideal for printing fine pitch devices such as QFP 0.5mm – 0.4mm and BGA 0.65mm – 0.5mm spacing.
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