GP300 is a silicone based thermal interface gap pad designed for easy application and good thermal conductivity. It comes in 200x200mm square sections, which can be cut down to size if required and is available in a variety of thicknesses S = 0.5mm SL = 1mm. GP300 is suitable for a wide variety of applications due to its high thermal conductivity value of 3W/m.K. It is best suited to applications where the pressure of the contact surface is high, thus ensuring that the material fills all the air pockets in the interface.

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GP500 is more a specialist gap pad designed specifically to exhibit a very low thermal resistance value. It comes in a 200x400mm section which can be easily cut down if required and is easy to apply, streamlining production and minimising mess. It's available in a variety of thicknesses, S = 0.5mm SL = 1mm, for different applications making it suitable for a wide variety of applications, maintaining an impressive thermal conductivity value of 5W/m.K.

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Key Product Features & Benefits:

• 200x200mm Thermal interface material
• Different thickness available
• Quick and easy to apply
• Excellent electrical insulation
• Wide operating range -50°C - 160°C
• RoHS Compliant

General Areas of Use:

• Consumer electronics
• Telecommunications – data centre servers
• Automotive –  EV batteries and ECU’s
• Lighting applications (including LEDs).

More Specific Areas of Use:

• Engine and transmission control modules; effectively this controls actuators on an internal combustion engine to ensure optimal performance
• Memory modules for PC’s and laptops
• Power conversion equipment; semi converters and/or transformers, (converting DC to AC or a complete change of voltage). This would apply for applications such as chargers, power grid, solar panels and wind turbines).
• MOFSET arrays with common heat sinks, for example a field effect transistor.
• Microprocessors/graphic processors
• Semi-conductors

Product Number : GP300 / GP500