ALPHA® PowerBond® 2110 Sn90Pb10 Solder Preforms are based on a family of lead-free, high-reliability alloys with 5% Antimony (Sb) content. Antimony addition results in increased strength, thermal fatigue resistance and higher liquidus temperatures, compared to traditional tin/silver/copper based lead-free systems.
In addition, ALPHA® PowerBond® Solder Preforms comply with applicable environmental standards, including RoHS for use in products requiring lead-free materials. They are manufactured with 99.99% purity (4N alloy) ensuring highest performance. The preforms can be customized with ALPHA® TrueHeight® Preforms technology (for bond-line thickness and tilt control) and pre-coated with ALPHA® AccuFlux™ series for difficult to solder surfaces.
ALPHA® PowerBond® 2110 preforms balance high creep resistance of Sn90Sb10 system with high thermal conductivity required for the power semiconductor devices operating at high junction temperatures (150-175°C). The alloy composition has been particularly tailored to enable easy wetting and low voiding.
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