Solder Connection

Solutions in Soldering Technology

PowerBond 2110 Preform

ALPHA® PowerBond® 2110 Sn90Pb10 Solder Preforms are based on a family of lead-free, high-reliability alloys with 5% Antimony (Sb) content. Antimony addition results in increased strength, thermal fatigue resistance and higher liquidus temperatures, compared to traditional tin/silver/copper based lead-free systems.  

In addition, ALPHA® PowerBond® Solder Preforms comply with applicable environmental standards, including RoHS for use in products requiring lead-free materials.  They are manufactured with 99.99% purity (4N alloy) ensuring highest performance. The preforms can be customized with ALPHA® TrueHeight® Preforms technology (for bond-line thickness and tilt control) and pre-coated with ALPHA® AccuFlux™ series for difficult to solder surfaces.

ALPHA® PowerBond® 2110 preforms balance high creep resistance of Sn90Sb10 system with high thermal conductivity required for the power semiconductor devices operating at high junction temperatures (150-175°C). The alloy composition has been particularly tailored to enable easy wetting and low voiding.

Key Products Features & Benefits: 

  • High creep resistance and tensile strength with high thermal conductivity than traditional Pb-free alloys
  • Excellent voiding with easy wetting
  • Excellent lead-free alternative to high lead alloy applications
  • Capable for processing in traditional SMT lines as well as vacuum soldering ovens (with formic acid)
  • Reduced solder defects through special Vaculoy process


Product Number : 247072