Solder Connection

Solutions in Soldering Technology


Nano coating solder paste stencils is a proven technology, the coating is both hydrophobic and fluxophobic together with being very durable and long lasting. When applied to the bottom-side of the stencil foil and stencil aperture walls, it minimizes solder paste’s ability to stick to the foil surface. 

Up to a 10X increase in the number of prints before cleaning the stencil is possible as well as successful printing at lower surface area ratios.You will also see improvements in print quality and increases in paste transfer efficiency, a treated stencil is 8 times more oil repellent than an untreated stencil even after 100,000 abrasion cycles.

This coating is compatible with all stencil cleaning equipment, as well as the majority of stencil cleaning solutions on the market.

Key Product Features and Benefits:

  • Better Quality Printing
  • Reduce Underside Cleaning
  • Durable and cost effective
  • Even Treats Aperture Walls
  • Increased Print Reliability
  • Reduce Flux Bleed
  • Reduce Solder Ball Transfer
  • Improve First Pass Yield