Solder Connection

Solutions in Soldering Technology


OM-535 Lead-Free Solder Paste

ALPHA® OM-535 was developed with the aim to  improve the solder joint performance, both for drop shock and thermal cycling, versus the existing low temperature products on the market.

The enhanced properties of low temperature SBX02 alloy combined with the  advanced chemistry performance of OM-535 enables  the formation of a  better solder joint  by improving the mechanical performance and solder  joint cosmetics using low temperature process settings.

Key Products Features & Benefits:    

  • Enables elimination of a second or third reflow cycle when temperature sensitive components or connectors are used.    
  • Reduces energy consumption in reflow ovens versus standard lead free alloys.    
  • Reduces reflow process cycle time.
  • Delivers 8+ Hour stencil life.
  • Potential elimination of bar solder, wave soldering flux, and energy costs associated with wave soldering.
  • Compatible with all commonly used lead free surface finishes  (Entek HT; Alpha Star Immersion Silver, Immersion Tin, Ni/Au, SACX HASL,  etc.)
  • Excellent resistance to random solder balling, minimizing rework and increasing first time yield.
  • Low temperature reflow profiles may enable the use of less expensive printed circuit board substrates.
  • Delivers very high in-circuit pin test yields, minimizing costly false negative test results.    
  • Compatible with either nitrogen or air reflow.    
  • Possesses excellent solder drip resistance during reflow.
  • J-STD Classification: ROL0

 

Product Number : 163376

Prod. No. 163376
OM-535 T4 SAC305 SOLDER PASTE 500GM

Data Sheets and Info

Health & Safety

Technical Bulletin

Product Flyer

ROHS Certificate

Related Technical Documents

FAQ's

Q - What is colophony and can it cause any health issues?
A - Colophony is a generic term for rosin, this is the sap or sticky substance that derives from pine and spruce trees. Its "stickiness" lends itself to being used in a wide range of products. We have traditionally used this product in fluxes due to these specific properties it can however lead to breathing difficulties and skin sensitivity. Always use fume filtration when soldering and change filters regularly.

Q - What is the difference between rosins and resins?
A - The terms are often used interchangeably, but rosin is a naturally occurring substance, and resin is either a modified rosin or completely synthetic material. Rosins are plant based products and are subject to more natural variation than resins, however resins are commonly used in newer flux formulations due to their more consistent performance.

Q - Do I need to change my printing process when I go to finer printing from size 3 to size 4 paste?
A - Generally when changing from T3 to T4 there is not much difference in printing setup. Depending upon the paste used you may have to make slight adjustments to print parameters such as release speed as aperture fill is greater with finer powders on small apertures but this is just to optimise the print as you would do when changing any paste. It’s by no means certain you will need to do this but it may give you further benefits.

Q - Do I need to change my printing process when I go to Ultra Fine printing from size 4 to size 5 paste?
A - The biggest change will be going to PS5 and its not so much the printing parameters changing but the stencils are invariably a lot thinner and so you need good support and setup such as making sure you have a release distance of 3 mm set (the distance over which release speed is controlled as the stencil acts more like a drum skin) I would also run with the minimum pressure to avoid stencil damage (coining) this is as most PS stencils are <100µm typically 75µm in thickness. It’s not as bad with PS4 as most stencils are in the 100µm or slightly above range and are more robust.

In all cases (can’t really think of an exception) smaller powder sizes go hand in hand with printing smaller features. Smaller features as we approach Area Ratio 0.66 and in some cases people try to/do operate in the region of AR 0.6-0.66 mean that the printing process has to be good, you have to “respect the fundamentals” i.e. board support, calibration of such things as print height, squeegee condition, decent PCB quality, registration etc.

Again more a feature of small apertures rather than the powder size of paste itself you may need to look at what is your maximum ‘abandon’ time with any paste if you run a start stop process and work to it i.e. don’t exceed and use automatic under screen cleaning where needed. Smaller apertures tend to ‘clog’ more readily and so may need a more frequent aperture clean regime.

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