The intermetallic compound thickness is critical in the formation of a solder joint. Connection Validation (CV) evaluates the quality of the solder joint by calculating the intermetallic compound formation and provides closed loop feedback to the operator.
CV provides feedback to the operator via the LED light ring integrated in the hand-piece. It takes the risk associated with the variables involved in the soldering activity and removes the success and failure determination of a good solder joint out of the hands of the operator.
CV complements the skill of the operator to judge the quality of a solder joint by introducing an objective method of evaluating solder joint quality. This systemic and objective approach provides repeatability and a measureable standard to the soldering process.
Key Product Features and Benefits: