Solder Connection

Solutions in Soldering Technology

Surface cure thermal paste - SCTP

SCTP is a thermal interface material for use where the efficient thermal coupling of electrical components is required. It is specially designed to resist pumping out from the bond line and can be applied using industrial dispensing equipment or via screen/stencil printing techniques.

Key Product Features & Benefits:

  • Pump-out resistant and high thermal stability; ideal for applications with rapid temperature cycling 
  • Solvent-free, efficient application; can be applied by screen/stencil print or dispensing equipment  
  • Good thermal conductivity and low thermal resistance; designed for use at the thermal interface 
  • Non-setting; allows simple/efficient rework of components and minimises effects of CTE mismatch


Prod. No. SCTP310ML
Surface Cure Thermal Paste 310ml

Data Sheets and Info

Technical Bulletin

Product Guide