Solder Connection

Solutions in Soldering Technology

Non-Silicone Heat Transfer Compound PLUS Xtra - HTCPX

HTCPX provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil. The exceptional properties obtained from HTCPX are due to the novel use of various metal oxide (ceramic) powders. These materials are electrically insulative to ensure that leakage currents can not be formed if the paste should come into contact with other parts of the assembly.

Key Product Features & Benefits

  • Excellent non-creep charactistics 
  • Vibration stable, designed for gap filling applications 
  • Wide operating temperature range: -50°C to +130°C 
  • Exceptional thermal conductivity: 3.40 W/m.K 
  • Low in toxicity Low evaporation weight loss


Prod. No. HTCPX700G
Heat Transfer Compound Plus Xtra 700g

Prod. No. HTCPX25K
Heat Transfer Compound Plus Xtra 25kg

Prod. No. HTCPX_LV12.5
Heat Transfer Compound Plus Xtra - Low Viscosity - 12.5KG

Data Sheets and Info

Health & Safety

Technical Bulletin

Product Guide