Vapor Phase Soldering, is also known as Condensation Soldering and uses Galden® fluorinated fluids which act as a heat transfer medium when it emits controlled thermal energy during its phase change from gas like to solid state. This phase change (Condensation) on the surface of the soldering substrate will last until the assembly has reached the temperature of the vapor, commonly 215 or 230 degrees centigrade.
Due to the high vapor density of Galden® Fluids and the condensation process the complete heating-up process takes place at an oxygen free environment. Vapour phase is considered to have process advantages over convection in terms of giving control and stability over the reflow cycle ideal for special applications such as high mass, densely populated or complex printed circuit boards.
Following advantages are resulting with these physical principles:
Key Product Features & Benefits:
Galden® Comparison Chart
Properties | LS215 | LS230 | HS240 |
---|---|---|---|
Boiling Point (°C) | 215 | 230 | 240 |
Density (g/cm3) | 1.80 | 1.82 | 1.82 |
Kinematic Viscosity (cSt) | 3.80 | 4.40 | 5.30 |
Vapor Pressure (Pa) | 12 | 3.4 | 1 |
Specific Heat (J/Kg·°C) | 973 | 973 | 973 |
Heat of Vap. at Boiling Point (J/g) | 63 | 63 | 63 |
Thermal Conductivity (W/m·°C) | 0.07 | 0.07 | 0.07 |
Coefficient of Expansion (cm3/cm3·°C) | 0.0011 | 0.0011 | 0.0011 |
Surface Tension (dyne/cm) | 20 | 20 | 20 |
Dielectric Strength (kV - 2.54 mm gap) | 40 | 40 | 40 |
Dielectric Constant | 2.1 | 2.1 | 2.1 |
Volume Resistivity (Ohm·cm) | 1015 | 1015 | 1015 |
Average Molecular Weight (amu) | 950 | 1020 | 1085 |
Prod. No. CH-193-002
Galden HS240 Vapour Phase Fluid 5KG
Prod. No. CH-193-005
Galden LS230 Vapour Phase Fluid 5KG
Prod. No. CH-193-003
Galden LS215 Vapour Phase Fluid 5KG