Solder Connection

Solutions in Soldering Technology


CVP-390 Lead-Free Solder Paste

ALPHA® CVP-390 is a lead-free, Zero-halogen  no-clean solder paste designed for applications where residue with excellent pin testing property and ability to pass JIS Copper Corrosion test are required. 

This product is  also  designed  to enable consistent  fine  pitch  printing  capability,  down to 180μm circle printed with 100μm thickness stencil. Its excellent print volume deposit repeatability also provides value by reducing defects associated with print process variability. Additionally, CVP-390 achieves IPC7095 Class III voiding performance.  

Key Products Features & Benefits:

  • Long  Stencil  Life: consistent performance for at least 8 hours of continuous printing without addition of new paste.
  • Long, High Tack Force Life: ensures high pick-and-place yields, good self-alignment.
  • Wide Reflow Profile Window: allows best quality solderability of complicated, high density PWB assemblies in both air and nitrogen reflow, using ramp and soak profiles, as high as 175 to 185°C.
  • Reduced Random Solder Ball Levels: minimizes rework and increases first time yield.
  • Excellent Coalescence and Wetting Performance: coalesced 180μm circle deposit, even at high soak profile environment.
  • Excellent Solder Joint and Flux Residue Cosmetics: after reflow soldering, even using long/high thermal soaking, without charring or burning.
  • Excellent Voiding Performance: Meets IPC7095 Class III Requirement.
  • Halogen Content: Zero Halogen, no halogen intentionally added.
  • Residue: Excellent Pin Testing property and Pass JIS Copper Corrosion Test.
  • Safe and Environmentally Friendly: Materials comply with RoHS and Halogen-free requirements, as well as TOSCA & EINECS
  • J-STD Classification: ROL0

 

Product Number : CVP390

Prod. No. 155717
Alpha CVP390 SAC305 500g

Prod. No. 156604
Alpha CVP390 SAC305 600g

Prod. No. 158173
Alpha CVP390 T4.5 SAC305 500g

FAQ's

Q - What is colophony and can it cause any health issues?
A - Colophony is a generic term for rosin, this is the sap or sticky substance that derives from pine and spruce trees. Its "stickiness" lends itself to being used in a wide range of products. We have traditionally used this product in fluxes due to these specific properties it can however lead to breathing difficulties and skin sensitivity. Always use fume filtration when soldering and change filters regularly.

Q - What is the difference between rosins and resins?
A - The terms are often used interchangeably, but rosin is a naturally occurring substance, and resin is either a modified rosin or completely synthetic material. Rosins are plant based products and are subject to more natural variation than resins, however resins are commonly used in newer flux formulations due to their more consistent performance.

Q - Do I need to change my printing process when I go to finer printing from size 3 to size 4 paste?
A - Generally when changing from T3 to T4 there is not much difference in printing setup. Depending upon the paste used you may have to make slight adjustments to print parameters such as release speed as aperture fill is greater with finer powders on small apertures but this is just to optimise the print as you would do when changing any paste. It’s by no means certain you will need to do this but it may give you further benefits.

Q - Do I need to change my printing process when I go to Ultra Fine printing from size 4 to size 5 paste?
A - The biggest change will be going to PS5 and its not so much the printing parameters changing but the stencils are invariably a lot thinner and so you need good support and setup such as making sure you have a release distance of 3 mm set (the distance over which release speed is controlled as the stencil acts more like a drum skin) I would also run with the minimum pressure to avoid stencil damage (coining) this is as most PS stencils are <100µm typically 75µm in thickness. It’s not as bad with PS4 as most stencils are in the 100µm or slightly above range and are more robust.

In all cases (can’t really think of an exception) smaller powder sizes go hand in hand with printing smaller features. Smaller features as we approach Area Ratio 0.66 and in some cases people try to/do operate in the region of AR 0.6-0.66 mean that the printing process has to be good, you have to “respect the fundamentals” i.e. board support, calibration of such things as print height, squeegee condition, decent PCB quality, registration etc.

Again more a feature of small apertures rather than the powder size of paste itself you may need to look at what is your maximum ‘abandon’ time with any paste if you run a start stop process and work to it i.e. don’t exceed and use automatic under screen cleaning where needed. Smaller apertures tend to ‘clog’ more readily and so may need a more frequent aperture clean regime.

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