ALPHA® CVP-360 is a lead-free, halogen free no-clean solder paste designed for a broad range of applications. CVP-360 is designed to enable the use of ALPHA SACX alloys, while offering reflow process yields comparable with higher silver SAC alloys (SAC 305 and SAC 405).
CVP-360 also offers extremely high in circuit pin test yields, which can reduce the circuit board assembly process cycle time due to fewer false negative rework steps. CVP-360’s excellent print volume deposit repeatability also provides value by reducing defects associated with print process variability. Until now, solder paste with high spread and wetting properties with low silver SAC alloys have had poor in circuit pin test yields, high halogen levels, or both. CVP-360 eliminates the need to compromise properties when using either SACX Plus 0307 SMT or SACX Plus 0807 SMT alloys.
Key Products Features & Benefits:
Prod. No. 154230
Alpha CVP-360 SACX 500g
Health & Safety
Q - What is colophony and can it cause any health issues?
A - Colophony is a generic term for rosin, this is the sap or sticky substance that derives from pine and spruce trees. Its "stickiness" lends itself to being used in a wide range of products. We have traditionally used this product in fluxes due to these specific properties it can however lead to breathing difficulties and skin sensitivity. Always use fume filtration when soldering and change filters regularly.
Q - What is the difference between rosins and resins?
A - The terms are often used interchangeably, but rosin is a naturally occurring substance, and resin is either a modified rosin or completely synthetic material. Rosins are plant based products and are subject to more natural variation than resins, however resins are commonly used in newer flux formulations due to their more consistent performance.
Q - Do I need to change my printing process when I go to finer printing from size 3 to size 4 paste?
A - Generally when changing from T3 to T4 there is not much difference in printing setup. Depending upon the paste used you may have to make slight adjustments to print parameters such as release speed as aperture fill is greater with finer powders on small apertures but this is just to optimise the print as you would do when changing any paste. It’s by no means certain you will need to do this but it may give you further benefits.
Q - Do I need to change my printing process when I go to Ultra Fine printing from size 4 to size 5 paste?
A - The biggest change will be going to PS5 and its not so much the printing parameters changing but the stencils are invariably a lot thinner and so you need good support and setup such as making sure you have a release distance of 3 mm set (the distance over which release speed is controlled as the stencil acts more like a drum skin) I would also run with the minimum pressure to avoid stencil damage (coining) this is as most PS stencils are <100µm typically 75µm in thickness. It’s not as bad with PS4 as most stencils are in the 100µm or slightly above range and are more robust.
In all cases (can’t really think of an exception) smaller powder sizes go hand in hand with printing smaller features. Smaller features as we approach Area Ratio 0.66 and in some cases people try to/do operate in the region of AR 0.6-0.66 mean that the printing process has to be good, you have to “respect the fundamentals” i.e. board support, calibration of such things as print height, squeegee condition, decent PCB quality, registration etc.
Again more a feature of small apertures rather than the powder size of paste itself you may need to look at what is your maximum ‘abandon’ time with any paste if you run a start stop process and work to it i.e. don’t exceed and use automatic under screen cleaning where needed. Smaller apertures tend to ‘clog’ more readily and so may need a more frequent aperture clean regime.