Stencil cleaning is becoming more critical due to component miniaturisation. Maintaining your stencil in optimum condition both on the production line and before storage will greatly increase your overall yields. Many solder defects, some estimate up to 70%, can be attributed to the stencil printing process. You need to aim for a consistent transfer efficiency at all times by maintaining aperture cleanliness.
KYZEN can improve your stencil cleaning efficiency with their specially formulated cleaners, covering manual wipe, understencil, ultrasonic immersion and spray in air applications.
Stencil Cleaning
| Soils Removed | Processes | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Product | Chemistry | QA/Water Soluble | No Clean/RMA | Raw Solder Paste | Uncured Adhesive | Ultrasonic Wash (Cleaner) Rinse* | Under Stencil Wipes | Pre-Saturated Wipes | Spray-In-Air Water Rinse | Spray-In-Air Cleaner Rinse | Hand-Held Ultrasonic Transducer |
| Aquanox A8820 | Aqueous | • | • | • | • | • | • | • | |||
| Cybersolv C8622 | Solvent | • | • | ||||||||
| Cybersolv C8882 | Solvent | • | • | • | • | • | • | • | |||
| Kyzen E5611 | Aqueous | • | • | • | • | ||||||
| Kyzen E5631 | Aqueous | • | • | • | • | • | • | • | • | ||
* Only for Ultrasonic systems that keep chemistry in solution
