Solder Connection

Solutions in Soldering Technology


Stencil Cleaning Applications

Stencil cleaning is becoming more critical due to component miniaturisation. Maintaining your stencil in optimum condition both on the production line and before storage will greatly increase your overall yields. Many solder defects, some estimate up to 70%, can be attributed to the stencil printing process. You need to aim for a consistent transfer efficiency at all times by maintaining aperture cleanliness.

KYZEN can improve your stencil cleaning efficiency with their specially formulated cleaners, covering manual wipe, understencil, ultrasonic immersion and spray in air applications.

Stencil Cleaning




Soils Removed
Processes

Product
Chemistry 
QA/Water Soluble
No Clean/RMA
Raw Solder Paste
Uncured Adhesive
Ultrasonic Wash (Cleaner) Rinse*
Under Stencil Wipes
Pre-Saturated Wipes
Spray-In-Air Water Rinse
Spray-In-Air Cleaner Rinse
Hand-Held Ultrasonic Transducer
Aquanox A8820
Aqueous










Cybersolv C8622
Solvent









Cybersolv C8882 
Solvent









Kyzen E5611
Aqueous










Kyzen E5631
Aqueous










* Only for Ultrasonic systems that keep chemistry in solution