Senju Eco Solder Preforms are available in a range of sizes and shapes. With improvements in the performance and reliability of electronic equipment, the size of components and printed wiring boards are becoming smaller and their density is increasing. The Senju solder preform design can greatly assist in achieving interconnection on these high-density technologies.
Senju Eco Solder Preforms are available in various forms to match any application such as washer, ring, pellet, chip, disk or ribbon. Solder Coated surface mounted components are becoming increasingly miniaturised for high density packaging on printed circuit boards. This innovative coating method makes a solder coating practicable on Kovar or Nickel silver substrates.
Senju can also offer package-sealing materials and protective cases on a range of components with this new technology.