Solder Connection

Solutions in Soldering Technology


Senju Solder Paste

Senju is at the forefront of development for new solder pastes to address society’s ever changing need for faster communication, greater memory , product miniaturisation, higher reliability in automotive and medical fields, together with personnel devices and wearables. All these differing sectors put a high demand on soldering companies to develop new alloys with finer powders together with more stable and insulative flux rheology’s.

Senju continues to not only support but further strengthen its research and development capability, offering both printable and jetting solder pastes that utilise particle 6 powder which can easily cope with 01005 chips and micro BGA devices. Common process problems such as Voiding, BGA Head in Pillow (HIP ), flux and solder splatter during laser reflow, low temperature alloys for temperature sensitive components and the need for stronger alloys offering higher reliability under shear strain and drop shock have all been addressed and are commercially available.


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Lead-Free Paste

Performance Indicators
Product
SAC305 (M705)
M794
M10
M40
L29
Type 4
Type 5
Type 6
J-STD
Low Voiding, High Reliability
GRN-360-K1-V8
x
x



x


ROL0
Fine Pitch Printing
ULT369
x





x

ROL0
Ultra-Fine Pitch
RGS800HF


x



x
x
ROL0
Low-Ag Solder Alloy
LS720V



x

x


ROL0
Low Temperature Solder Alloy
L29-145HF




x
x


ROL0


Leaded Paste

Performance Indicators
Product
Sn63 / Pb37
Sn62 / Pb36 / Ag2
Type 3
J-STD
Excellent Reliability
221CM-Z
x
x
x
ROL0