Within
today's electronics industry, it is widely accepted that
Electrostatic Discharge (ESD) events are a significant cause of device
failure and that implementing static control measures is not only
desirable but essential. Electrostatic damage to electronic devices
can
occur at any point from manufacturing to field service.
Damage results from
handling the devices in uncontrolled surroundings or
when Esd control practices are poor. Generally damage is classified
in
two ways catastrophic meaning total product failure caused by junction
damage or oxide layer breakdown. Such breakdowns are picked up
at test.
Latent damage is more
difficult to identify. A device may be partially
damaged or degraded but will continue to operate for some time
into the
future and lead to field failure and generally a cost to you
under
warranty.
The solder Connection
aims to ensure that all its products comply with
BS EN 61340-5
