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Solder Paste - Leadfree

ALPHA CVP360 LEAD FREE SOLDER PASTE
The Solder Connection

ALPHA CVP-360 is a lead-free, halogen free no-clean solder paste designed for a broad range of applications.
 
ALPHA CVP-360 is designed to enable the use of ALPHA SACX alloys, while offering reflow process yields comparable with higher silver SAC alloys (SAC 305 and SAC 405).


CVP-360 also offers extremely high in-circuit pin test yields, which can reduce the circuit board assembly process cycle time due to fewer false negative rework steps.


CVP-360’s excellent print volume deposit repeatability also provides value by reducing defects associated with print process variability.


Until now, solder paste with high spread and wetting properties with low silver SAC alloys have had poor in-circuit pin test yields, high halogen levels, or both. CVP-360 eliminates the need to compromise properties when using either ALPHA SACX® 0307 or ALPHA SACX® 0807 alloys.


 

Price: £ POA


ALPHA CVP520 LOW TEMPERATURE SOLDER PASTE
The Solder Connection

ALPHA® CVP-520 is designed to enable low temperature surface mount assembly technology.
 
The lead-free alloy in ALPHA® CVP-520 has a melting point below 140°C, and has been successfully used with peak reflow profiles between 155°C and 190°C. The flux residue from ALPHA® CVP-520 is clear, colorless, and provides excellent electrical resistivity, exceeding industry standards.


This product enables the elimination of an extra wave or selective wave soldering process when temperature sensitive through hole components are used in an assembly. Eliminating a wave soldering or selective soldering step can significantly lower the cost of producing an electronic assembly, increase daily throughput, eliminate the need for managing bar solder and wave soldering flux supplies and eliminate the need for pallets. The carefully selected Sn/Bi/Ag alloy in ALPHA® CVP-520 was selected to give the lowest melting point, lowest pasty range during melting and re-solidification, along with a very fine grain structure, offering maximum resistance to thermal cycle based fatigue. The alloy also yields very low voiding BGA solder joints, even when a traditional SAC alloy sphere is used.


All coponents used with ALPHA® CVP-520 must be lead-free to eliminate the formation of tin/lead/bismuth intermetallic which has a melting point under 100ºC.

Price: £ POA


ALPHA OM338 LEAD FREE DISPENSING SOLDER PASTE
The Solder Connection

This product is ideal for repair and rework of lead free solder joints. The product will flow smoothly through fine needle tips. When reflowed the flux residues are clear and colourless

Price: £ POA


ALPHA OMNIX 338PT LEAD & HALOGEN FREE SOLDER PASTE
The Solder Connection

ALPHA OM-338-PT is a lead-free, no-clean solder paste designed for a broad range of applications. ALPHA OM-338-PT's broad processing window is designed to minimize transition concerns from tin/lead to lead free solder paste.

This material is engineered to deliver the comparable performance to a tin lead process. ALPHA OM-338-PT yields excellent print capability performance across various board designs and, particularly, with ultra fine feature repeatability (11 mil squares) and high through-put applications.

ALPHA OM-338-PT is formulated to offer increased in-circuit pin test yields without compromising electrical reliability.

Classified as IPC J Standard ROLO

ALPHA ZERO Halogen products have no intentionally added halogens in their formulations.

Price: £ POA


ALPHA OMNIX 338T LEAD & HALOGEN FREE SOLDER PASTE
The Solder Connection

ALPHA OM-338-T is a lead-free, no-clean solder paste designed for a broad range of applications. ALPHA OM-338-T broad processing window is designed to minimize transition concerns from tin/lead to lead free solder paste. This material is engineered to deliver the comparable performance to a tin lead process. ALPHA OM-338-T yields excellent print capability performance across various board designs and, particularly, with ultra fine feature repeatability (11 mil Squares) and high throughput applications.

Broad latitude paste with wide process window. Capable of ultra fine print at up to 200mm/ sec print speed with barey visible residues. Excellent choice for replacement from traditional Tin / lead alloys. 338T has been optimised for increased print process window.

Classified as IPC J Standard ROLO

ALPHA ZERO Halogen products have no intentionally added halogens in their formulations.

Price: £ POA


ALPHA OMNIX OM325 LEAD FREE SOLDER PASTE
The Solder Connection

ALPHA OM-325 is a lead-free, no-clean solder paste designed for ultra fine feature printing and reflow. This paste has a wide processing window that provides a surface mount process solution for component metrics down to 0402mm (01005inch).

ALPHA OM-325 yields excellent print capability performance across various board designs and particularly with fine feature repeatability of 0.16mm (6.5mil circles) across 8 hours production.

Classified to IPC J-Standard RELO

Price: £ POA


ALPHA WS819 LEAD FREE WATER SOLUBLE SOLDER PASTE
The Solder Connection

This water soluble solder paste is one of the latest in a range of products offering the ideal combination of printability under varying enviromental conditions, 8 hr stencil life, good resistance to BGA voiding, high speed combined with excellent cleanability with waterbased cleaning systems.

Classified to IPC J-Standard ORHO

Price: £ POA