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Alpha SM110 Wipes
The Solder Connection
ALPHA SM-110 Cleaner is a mixture of organic solvents designed specially for non-aqueous cleaning applications.
ALPHA SM-110 effectively removes most types of raw solder paste residues and uncured SMT adhesives.
It is also effective on post-soldering flux residues and other organic contaminants associated with printed circuit board assembly.
The product will evaporate completely with minimal odor. No water rinse is required.
ALPHA SM-110 is an excellent replacement for IPA in most applications
Price: £ POA
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Dermex Wipes
The Solder Connection
Designed primarily as a general purpose hand wipe for use on the shop floor. Mild but effective. supplied in easy seal and wipe clean packaging.
Price: £ POA
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Dry Ultrawipes
The Solder Connection
Surclean Ultrawipes are manufactured from virgin Polyester and Rayon hydro entangled into a high strength uniform fabric. The material is a premium quality product that has been custom developed to provide the optimum balance of attributes such as high absorbency, toughness, abrasion resistance and freedom from particle generation and abrasive characteristics found in other competing materials that contain wood pulp derived cellulose.
Ultrawipe material contain no wood pulp, reconstituted materials or chemical binding agents.
Ultrawipe has been specially developed for the demanding service conditions of Under Stencil Automatic Cleaning systems and heavy-duty manual wiping tasks. It is also suited to critical applications involving lens and optic cleansing.
Ultrawipe material is stable when saturated with all types of industrial solvents, acids, alkali, amines etc. and exhibits exceptional wet burst strength and stability when pre-saturated with cleaning solvent blends. Ultrawipe material has been specified to have one side smooth and the other side with an embossed pattern to give an additional cleaning action when removing heavy soiling during wiping operations.
Wipe size is 230mm x 150mm.
Ultrawipes are also available airwashed and double bagged to cleanroom class 100 specifications.
Price: £ POA
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ECOWIPE IPA/DI Saturated Economy Wipes
The Solder Connection
Lightweight general purpose economy cleaning wipes saturated with 70/30 % mixture of Isopropanol Alcohol and de-ionized Water. Low linting and absorbant.
Tub of 200 sheets perforated to tear off, size 200mm x 220mm.
Suitable for a variety of cleaning applications within general manufacturing and Electronics assembly. Container supplied foil sealed for extended shelf life and resealable pull through lid.
Price: £ POA
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MICROCARE POLYESTER & CELLULOSE WIPES
The Solder Connection
Jumbo 50 SHEET economy package of an economical paper.
Lint-free, good purity; optimal size for stencil wiping Size: 9x9 inches, 23x23 cm
Materials: Polyester & Cellulose Hydroentangled (No binders) Basis Weight: 2.1 Oz. Color: White Surface: Smooth Edges: Knife Cut Particulate: 15.4 Absorbency:
Clean Room Packaged, suitable for Class 100
Cleanroom Packaging: 50 sheets per bag, 25 bags per case
Price: £ POA
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Norwipes
The Solder Connection
Lint free wipes designed for stencil cleaning avoid apearture filliing with traditional low performance products.
Price: £ POA
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Screen and Stencil Wipes SSW
The Solder Connection
Superb cleaning power , leaves stencil clean and dry with no staining.
Price: £ POA
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Surfex IPA Saturated Wipes
The Solder Connection
Surfex wipes are supplied in quick seal wipe clean packaging. Designed for stencil cleaning after bulk solder paste removal and final cleaning of critical machine parts after maintanence packaging
Price: £ POA
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Ultrawipes IPA / DI Satuated
The Solder Connection
Ultrawipes are manufactured from a synergistic blend of virgin Polyester and Rayon hydro entangled into a high strength uniform fabric.
The material is a premium quality product that has been custom developed to provide the optimum balance of attributes such as high absorbency, toughness, abrasion resistance and freedom from particle generation and abrasive characteristics found in other competing materials that contain wood pulp derived cellulose.
Ultrawipe material contain no wood pulp, reconstituted materials or chemical binding agents.
Ultrawipe has been specially developed for the demanding service conditions of Under Stencil Automatic Cleaning systems and heavy-duty manual wiping tasks. It is also suited to critical applications involving lens and optic cleansing. Ultrawipe material is stable when saturated with all types of industrial solvents, acids, alkali, amines etc. and exhibits exceptional wet burst strength and stability when pre-saturated with cleaning solvent blends.
Ultrawipe material has been specified to have one side smooth and the other side with an embossed pattern to give an additional cleaning action when removing heavy soiling during wiping operations. Wipe size is 230mm x 150mm.
Saturated Ultrawipes have the highest level of saturation of any wipe available (2 litres/200 wipes) for maximum cleaning performance and shelf life. Saturated Ultrawipes are also available filtered to 0.1um, airwashed and double bagged to cleanroom class 100 specifications.
Price: £ POA
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USC400 ULTRASONIC STENCIL CLEANING SYSTEM
The Solder Connection
The SMT USC400 is a highly portable Ultrasonic contact type Stencil Cleaning system.
In use the operator moves the hand tool over the Stencil after spraying with cleaning fluid. The tranducer in the hand tool vibrates the contamination through even the smallest Stencil apertures. The residues are collected on disposable wipe material under the Stencil.
The SMT USC400 excels in removing difficult high tack residues such as those found with Lead free Solder materials. Direct contact Ultrasonic cleaning is the most effective way to remove Lead free Solder paste residues from fine pitch Stencils.
The SMT USC400 is suitable for both offline and on Printer cleaning operations. Stencil cleaning can be carried out on the Printer without removing the Stencil frame. Because the USC400 is highly portable, it can be easily moved between work areas or Printers. An optional Ultrasonic Mini-bath is available which extends the versatility by allowing cleaning of machine accessories such as placement nozzles, glue dispensing needles and test probes etc.
SMT USC400 Features:
Light weight, yet with a rugged constuction for workplace portability.
Suitable for all Stencil materials including Plastic.
Suitable for cleaning all pastes, adhesives and inks.
Advanced Transducer Autotuning system gives optimum cleaning performance on all applications.
SMT USC400 Benefits
Inprove your process yields!!!!!
No longer do you have to take the screen out of the printer to clean those couple of blocked apperatures, simply take the USC400 to the machine and clean in situ. Thus giving you minimum down time, without the need to fully clean the stencil off line and negating the need to perform a complete realignment of the stencil when you reinstall after using traditional cleaning methods.
The system is both simple to use and as its designed with low voltage its safe for the operator or technician to use.
Price: £ POA
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