Fluxes - Leadfree

ALPHA FLUX EF2202 HALOGEN FREE
The Solder Connection

EF2202 is a low VOC, halide and colophony free, no-clean flux which provides the highest activity of any low-VOC-free flux.

This flux is Bellcore compliant giving defect-free soldering. It has been formulated to deliver excellent wetting and top-side hole fill, even with OSP coated bare copper boards which have undergone prior thermal excursions.

Several proprietary additives are also included to reduce the surface tension between the solder mask and the solder; thereby, dramatically reducing the tendency of solderball generation.

If you have already been using low solids, low residue flux technology then this flux is a direct replacement, needing little if any tweaking to achieve similiar levels of soldering yield.

Classified as J Standard ORLO

ALPHA ZERO Halogen products have no intentionally added halogens in their formulations.

Price: £ POA

ALPHA FLUX EF2210
The Solder Connection

Alpha EF2210 is VOC-Free, halide-free, rosin/resin-free, low solids no-clean flux.
which provides the highest activity of any VOC-free Bellcore SIR compliant flux for defect-free soldering.

It is formulated with a proprietary mixture of organic activators which deliver excellent wetting and top-side hole fill, even with OSP coated bare copper boards which have undergone prior thermal excursions. Several proprietary additives are also formulated into EF-2210 which act to reduce the surface tension between the solder mask and the solder; thereby, dramatically reducing the tendency of solderball generation.

The formulation of EF-2210 is also designed to be more thermally stable; thereby, reducing the occurrence of solder bridging.

Classified as J Standard 0RL0

Price: £ POA

ALPHA FLUX EF6000
The Solder Connection

ALPHA EF-6000 was specifically developed to deliver outstanding board cosmetics and to eliminate the tendency for solder balling and solder bridging, two types of defects which are normally associated with the use of the chip wave. Of all low solids (< 4% solids), no-clean fluxes, ALPHA EF-6000 exhibits the lowest tendency for solder ball generation over a wide variety of solder masks during wave soldering and selective soldering operations.

ALPHA EF-6000 should be considered for use by any assembler who has board designs which are sensitive to solder bridging, performs pin testing, or whose specification requires an extremely low frequency of solder balls.

ALPHA EF-6000 is an active, low solids, no-clean flux. It has been designed with a wide thermal process window enabling
best-in-class productivity with lead-free wave soldering applications. Several proprietary additives are formulated into this flux to reduce the surface tension between the solder mask and the solder thereby, dramatically reducing the tendency of solder ball generation. The formulation of ALPHA EF-6000 is more thermally stable, thereby, reducing the occurrence of solder bridging during lead-free dual wave soldering.

Classified as J Standard ORLO

Price: £ POA

ALPHA FLUX EF6100
The Solder Connection

ALPHA EF-6100 is a high-reliability, IPC, Bellcore, and JIS compliant, low solids, no-clean flux. It has been designed with a wide thermal process window enabling best-in-class productivity with lead-free wave soldering applications, and is an excellent choice for remaining tin-lead production lines. ALPHA EF-6100 is formulated with a proprietary mixture of organic activators to give more thermal stability, thereby reducing the occurrence of solder bridging during lead-free dual wave soldering.

Classified J Standard 0RL0

Price: £ POA

ALPHA FLUX EF8000
The Solder Connection

ALPHA EF-8000 is a rosin-containing flux designed to provide the attributes of excellent solderability and reliability in general and high-density boards in both Lead-Free and Leaded processes. It is designed to have low bridging on bottom side QFP

Price: £ POA

ALPHA OM338 LEAD FREE FLUX GEL
The Solder Connection

Alpha OM338 Lead Free Flux Gel is designed as an alternative to liquid fluxes when reworking quad packs, BGA,s etc.

The natural tackiness of the product will when applied between the two solderable surfaces will keep the component in place ready for reflowing back into place.

The post soldering residues have been designed to be left in place and are intrisinically safe for most applications.

The product is supplied in small sysringes for either manual or machine dispensing.

Price: £ POA

ALPHA THINNERS 425
The Solder Connection

All Alpha fluxes are thinned to the correct Specific Gravity (SG) reading using a proprietry blended thinner such as Alpha 425 This product uses only non-hydrous IPA of the highest quality. do not compromise on quality products.

Price: £ POA