Component Stenciling Templates
Metcal has developed a new solder paste printing method,
Component Stenciling Templates, for printing on the underside
of components. This easy procedure is designed for use
on PBGA, CBGA, CSP balled devices as well as Land Grid
Array (LGA) components. Not only is this new process simple,
it's also quick to perform and can increase productivity
four to five times in place of stenciling the PCB substrate.
This is an ideal process for small components and situations
where traditional stencil access is limited by the close
proximity of adjacent components.
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