The Solder Connection

APR Array Package Rework System Redefining Array Package Rework The APR-5000 Series Array Package Rework Systems embody the spirit and ingenuity of Metcal. In sleek designs, Metcal engineers have incorporated state-of-the-art vision, and closed-loop time, temperature and airflow control. Precision placement and powerful software make the rework of complex array packages easy, fast and extremely reliable. Economical and easy to use, the APR-5000 Series Array Package Rework Systems deliver high-end BGA/CSP functionality, moving far beyond expensive rework machines by offering unparalleled performance at an affordable price with the precision that is engineered into every Metcal system.
The Industry Standard All machines in the APR-5000 Series Array Package Rework Systems share the same design intelligence, incorporating the ideal combination of essential hardware features and automated software necessary for reworking today's array packages. Closed-loop, computer-controlled time, temperature and airflow parameters help to guarantee process control and repeatability. Easy-to-program software manages the five stages of the reflow profile: pre-heat, soak, ramp, reflow and cooling. In addition, board temperature can be monitored using integrated flying thermocouples. Real-time adjustments can be made to all parameters while the profile is running.
To help guarantee uniformity and higher process yields, the APR-5000 Series Array Package Rework Systems employs a revolutionary single reflow/placement head that moves to the correct position for rework, thus allowing the PCB to remain stationary during the process. Plus, the PCB is centralized relative to the pre-heaters to provide superior uniformity of PCB temperature during rework. The enhanced software is instructive and intuitive, walking the engineer through the steps of process development and then instructing the operator to ensure consistent, repeatable execution of the automatic profile functions.
Compact, Powerful , Intelligent Design and functionality come together in the APR-5000 Array Package Rework System. Developed in direct response to current production needs and future industry trends, the APR-5000 Array Package Rework System provides closed-loop control, optimized vision and precise component placement in an ergonomically designed compact platform, just 19" x 30" (483mm x 762mm).
Capable of handling boards up to 9" x 15" (229mm x 381mm), with a placement accuracy to 0.001" (0.025mm) and interconnection pitches as low as 0.012" (0.3mm), the APR-5000 Array Package Rework System is ideal for reworking smaller assemblies, such as cell phones and laptop computers, at a very competitive cost. In addition, the APR-5000 Array Package Rework System uses standard mains voltages and self-contained pumps rather than special wiring and shop air. This allows the system to be set up and moved to any bench, without having to be fitted/plumbed in by an engineer. The APR-5000 Array Package Rework System is designed for the long term, with the ability to pre-heat boards uniformly, even those with lead-free solders, and deliver the higher solder melt temperatures necessary to rework lead-free assemblies.
Seeing Is Believing When it comes to reworking BGAs, CSPs, Land Grid Arrays (LGAs), Micro SMDs, Micro-Lead Frames (MLFs) and Bumped Chip Components, an important key to success is vision; the ability to see, align and accurately place components. It's here that the APR-5000 Array Package Rework System excels. The system incorporates Metcal's exclusive integral vision system that makes accurate component placement easy to achieve, allowing operators to simultaneously view the topside of the PCB and a superimposed image of the underside of the component. With micrometer adjustment, images can be accurately aligned in the X, Y & Theta axes prior to placement. In addition, integrating the vision system with the machine's software eliminates the need for multiple monitors.
Large Board Capability, Small Board Precision The APR-5000-XLS Array Package Rework System establishes a new benchmark for the precise, cost-effective rework of the widest range of PCBs and component types, from large boards up to 24.5" x 24.5" (622mm x 622mm) to components down to 0.020" x 0.010" (0.51mm x 0.25mm). Flexible enough to perform flawlessly with various sized PCBs, the APR-5000-XLS Array Package Rework System incorporates dual stage pre-heaters and has the thermal capacity and control to execute precise profiles of both large and small PCBs, delivering uniform temperature control horizontally, across the surface of PCBs up to 0.25" (6.35mm) thick, and vertically between the die and ball of the reworked component.
Closed-loop, computer-controlled parameters of time, temperature and airflow guarantee process repeatability and precision, even at the higher temperatures demanded by lead-free soldering. Motorized X, Y, Z adjustments speed placement and help guarantee flawless process repeatability. In addition, motorized Theta axis provides 360° rotation to simplify component orientation. Together, these advanced controls reduce operator fatigue, improve placement accuracy and offer the industry’s highest level of process consistency. New to the APR-5000-XLS Array Package Rework System is Metcal's innovative Split Vision System, which allows operators to view the opposite corners of a component, including splitting on rectangular components, with the necessary magnification to make its placement and registration fast and accurate.
Lead-Free Compatible As the implementation of lead-free assemblies intensifies and product designs change, the APR-5000-XLS Array Package Rework System has the power, size and sophistication to meet the required higher, cost-sensitive performance criteria. The ingenious Metcal single reflow/placement head design helps achieve a consistent, tight Delta T across the board and the component. Thermal damage is precluded due to the system's precisely controlled pre-heaters; lead-free profiles can be quickly developed via the system's five thermocouples; and closed-loop, computer controls and intuitive software help operators maintain the ideal process from start to finish. The APR-5000-XLS Array Package Rework System provides full convection in both reflow heater and dual stage pre-heaters to provide fast ramp and precise peak reflow temperature without thermal damage to sensitive components unsuitable for heating above 240°C. And with four heating zones and one cooling zone, the precise profiles needed for successful soldering/desoldering of lead-free packages are easily delivered.