The Solder Connection
and Cookson Electronics are teaming up to offer a new Lead-Free
Process Capability Validation Program. This program consists
of lead-free components and test boards from Practical Components,
with Cookson Electronics’ analytical evaluation and process
capability validation services to the IPC and J-STD requirements.
The CE Analytics Test
Kit consists of: PCB test boards with Polyclad™ FR-370HR
laminate, various lead-free compatible pad finishes (ENTEK® PLUS™ CU-106A,
ENTEK® PLUS™ CU-106A-HT and Alpha-LEVEL™ Immersion
Silver), industry standard lead-free components (BGA, MLF, QFP,
LQFP, SOIC, TSOP, SOT, and passives), ALPHA CUT™ laser-cut
stencil with Gerber data, ALPHA™ OM-338 lead-free solder
paste and ALPHA™ Telecore + cored wire, and process application
guidelines.
The CE Analytics laboratory services include:
- Lead-Free Process Capability Validation,
comprised of:
- Macro and microscopic inspection
and analysis of processed assemblies compared to IPC
and J-STD requirements.
- Validation Report with recommendations
for process optimization, if applicable
- CE Analytics Lead-Free Process
Capability Validation Certificate.
- Voiding Analysis
- Macroscopic Examination of Processed
Assemblies (non-destructive)
- Microscopic Examination of Solder Connection
Integrity.
Draw on CE Analytics expertise to validate
your lead-free process capabilities. You can reduce the cost, time,
and worry associated with converting to lead-free by using the
new CE Analytics Lead-Free Process Capability Validation. It is
an easy three-step procedure:
- Order the CE Analytics Lead-Free Test Kit, which includes boards,
materials and components to set up and run a lead-free SMT process.
- Order a service package from CE Analytics and
send in your processed boards. In return, you
will receive a detailed laboratory analysis,
report, recommendations for optimization if applicable,
and a Lead-Free Process Capability Validation
Certificate.
- Run your lead-free process
with confidence.
For more information concerning price,
delivery and how to order the new CE Analytics Lead-Free Process
Capability Validation Contact The Solder
Connection via our online
form or call us on 01291 624400
Definition of Cookson Electronic Materials
Included
Polyclad™ 370HR is a CAF
resistant, lead-free assembly compatible laminate
and prepreg system that is ideal for high-density
designs requiring multiple soldering steps. 370HR
materials contain a unique resin technology that
offers exceptional IST thermal performance and
reliability.
Alpha-LEVEL™ is an
immersion silver finish applied to circuit board solder pads that
develops a dense uniform silver deposit and provides excellent
Pb free soldering, reliability, and contact resistance.
ENTEK® PLUS™ CU-106A(X) is
the organic solderability preservative (OSP) most trusted by leading
original equipment manufacturers for excellent solderability, highest
solder joint reliability, and the only finish capable of mixed
metal processing such as electrolytic nickel immersion gold edge
connec
ENTEK® PLUS™ CU-106A HT is
a new OSP developed with all the features of existing ENTEK® PLUS™ OSPs
with the added feature of improved solderability for difficult
applications such as Pb free soldering.
ALPHA® OM-338 is a broad
latitude lead-free solder paste providing the lowest cost of ownership
proven through a wide print process window performance, ultra-fine
pitch printing capability (0.25mm circles and 0.4 mm pitch components)
and excellent voiding resistance exceeding IPC7095 Class III standards.
ALPHA® Telecore Plus is
a low residue core solder wire designed for no-clean soldering
applications that must meet all appropriate Bellcore specifications.
The unique blend of rosin and proprietary activators provides rapid
wetting while leaving minimal, optically clear, completely inert
residue.
Electroless Nickel/ Immersion Gold
(ENIG) is a leading immersion finish delivering excellent
coverage, uniformity and mechanical strength for good solderability.
Low temperature operation allows for good solder mask compatibility.
The finish has a long shelf-life and can withstand multiple thermal
cycles.
ALPHA® CUT Laser Cut Stencils are
designed and manufactured to provide the ultimate stencil printing
performance for most surface mount requirements, particularly when
used in conjunction with ALPHA® Solder Pastes or ALPHA® Surface
Mount Adhesives. The stencils are manufactured using a CAD/CAM
driven high precision XY-laser cutting process.
 Board size: 3.875" x 5.375"
Order Number: PCB030 (board only—customer to specify board finish upon
order. See PC board chart.)
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