The first product specifically developed to protect adjacent components during printed circuit board rework.
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- CoolCap(TM) protects adjacent IC components from secondary solder joint reflow due to stray heat from the rework process
- CoolCap(TM) fits common BGA and QFP size packages specifically for rework operations
- CoolShield(TM) protects passives and odd shaped components against excessive heat that can compromise device reliability
- Compatible with both tin-lead and lead-free solder rework
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PCB ready for rework with Coolcap
and CoolShield devices in place
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- Enables fast set up and high rework throughput and yield. All devices are reusable.
- Delivers repeatable performance.
- Provides up to 60°C temperature reduction for the adjacent component package body.
- Provides up to 35°C temperature reduction for the protected component solder joints.
- Prevents secondary reflow.
- Reduces the need for device-specific rework nozzles.
- Protects adjacent components from additional stray heat present with non-specific nozzles.
- Rests directly on the PCB, and does not require the use of adhesive or clean up.
- 1.5mm wall thickness allows fit despite close component placement.
- Eliminates undesirable temperature cycling of adjacent components.
- Compatible with Tin-Lead and Lead-Free rework processes.
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