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ALPHA FORM Electroform Stencils

ALPHA® FORM Electroformed Stencils are designed and manufactured to give the ultimate stencil printing for the most challenging surface mount requirements, particularly when used in conjunction with ALPHA® Solder Pastes. The stencils are manufactured using 100% solid nickel plating (electroforming process) resulting in high precision durable stencils of any custom thickness.

FEATURES & BENEFITS

High Repeatability: ALPHA® FORM Stencils are made using anytime the exact same manufacturing standards in order to deliver consistent performance by eliminating the two sources of variation through our Stencil Engineering System, ALPHA DIMENSIONS™:
     • Design Inconsistencies
     • Manufacturing Inconsistencies

High Precision: Produced from the modified CAD/CAM data in a climate controlled clean room using state of the art processing tools at 10.000 DPI resolution, resulting in a Aperture Size Accuracy of ± 0.5 mil (± 12.5 micron) with superior processing capability (CpK ≥ 1.33).

Ultimate Durability: Hard Nickel stencils (> 500 VH) provide typically twice the lifespan of stainless steel stencils.

Ultra Fine-pitch Printing: ALPHA® FORM Electroforming technology is targeted for print applications of 20 mil (0.5 mm) pitch and below and all area array packages (Flip-chip, CSP’s, μBGA’s, BGA’s and CCGA’s) as well as 0201 component technology.

Predictable Printing Results: Proprietary internal testing provided us with the science behind the printing. Our database with more then 12 million data points allowed us to quantify the effects of taper, surface finishes, positional accuracy and area ratio. This information is used in our best practice commonality program to ensure consistent and predictable print results.

Print Performance: In addition to the ability to provide local stepped area’s on the stencil, the ALPHA® FORM process can manufacture any optimized custom thickness for optimum paste transfer volumes. A special in-process sloped ‘Stepless Step’ can be created on the PCB side of the stencil in those area’s where large solder deposits are required.

 

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